Powered by Made-in-China.com
High-Precision Eutectic Die Bonder for Superior Wafer Production
US$300,000.00-500,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
SHM8120(120T)Speed
High SpeedPrecision
High PrecisionCertification
RoHS, ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterProduct Name
Wafer Die BonderFeature 1
High PrecisionFeature 2
High EfficiencyAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
High Precision & Speed: Features high precision and high speed capabilities for superior wafer production efficiency.
Comprehensive Certification: Equipped with RoHS, ISO, and CE certifications ensuring safety and quality standards.
Flexible Customization: Supports OEM, ODM, and design services for flexible customization of machine features.
Global Service Network: Exported to over 30 countries with a robust network of 200+ customers and suppliers.
Professional Support: Provides 24-hour online professional technical support for all equipment issues.
High Efficiency Design: Designed for high efficiency with mechanical time as low as 25 seconds per cycle.
Strict Quality Control: 100% inspection including visual and function checks before packing and shipping.
Versatile Application: Suitable for various L/F and resin sizes with adjustable molding and injection pressures.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.00h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What is the warranty period for the equipment?
A:
We provide a one-year warranty along with 24-hour online professional technical support.
Q:How to choose a suitable machine?
A:
Please provide the working piece material, size, and required machine functions. We will recommend the most suitable model based on our experience.
Q:Why choose our company?
A:
We offer OEM, ODM, and designing services, ensuring flexible customization and cost-effective solutions for your specific needs.
Q:What are the main products offered?
A:
Our main products include Die Bonders, Wire Bonding machines, Laser Marking, Laser Grooving, Laser Cutting, and Automatic Silicone Dispensing Equipment.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Precision Automatic Wafer Die Bonder for High-Speed Assembly
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High-Speed LED Die Bonder for Efficient Semiconductor Production
US$60,000.00-100,000.00
1 Piece(MOQ)
Small Semiconductor Die Bonding System, Wafer Die Attach Eutectic Bonder dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd210 Precision Die Bonder - 10-Inch Auto Wafer Ring Changer & Film Expander for 600×510mm Large Substrate Semiconductor Packaging
US$22,500.00-48,000.00
1 Piece(MOQ)
Small Die Bonder Die Pick and Place Machine for Wafer
US$90,500.00-119,000.00
1 Piece(MOQ)
High-Precision Die Bonder for Ultimate Wafer Dispensing Solutions
US$300,000.00-400,000.00
1 Piece(MOQ)
High-Precision Automatic Die Bonder for Efficient LED Packaging Solutions
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High Precision Asm Die Bonder Ad819 Dispensing Equipment for Semiconductor Packaging Solutions
US$10,000.00-1,000,000.00
1 Set(MOQ)
High Accuracy Die Bonder with Epoxy and Eutectic
US$90,500.00-119,000.00
1 Piece(MOQ)
Desktop Laboratory Gantry High-Precision Small Multifunctional Automatic Die Attach Die Mounter Automatic Eutectic Patch Chip Bonder
US$116,000.00-150,000.00
1 Piece(MOQ)
Ad832I Fully Automatic Asm Die Bonding Machine, Semiconductor Die Bonder for IC Packaging Production
US$100,000.00-120,000.00
1 Piece(MOQ)
Factory Direct Sales Asm High Speed LED Clip Wafer Die Bonder Ad50PRO
US$100,000.00-1,000,000.00
1 Set(MOQ)
Gkg Gd80+C Automatic Precision Die Bonder Lightweight Dual Swing Arm for LED & Semiconductor
US$12,500.00-38,000.00
1 Piece(MOQ)
Semiconductor High Precision Asmpt Siplace Ca2 Plus Die Bonding and Flip Chip Placement Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Desktop High Precision Semi-Automatic Die Bonder Crystal Bondering Machine Db100
US$90,500.00-119,000.00
1 Piece(MOQ)
China Used Besi Datacon 8800 FC Quantum Advx Manufactures Automatic Ball Wire Flip Chip Wedge Die Bonder
US$158,000.00-259,500.00
1 Piece(MOQ)
Gkg Gd91m6 Multi-Station Die Bonder High Accuracy for Display Module Manufacturing
US$32,500.00-38,000.00
1 Piece(MOQ)
Semiconductor Packaging Die Bonder Bonding Machine Eutectic Crystal Planting Machine
US$50,000.00-100,000.00
1 Piece(MOQ)
High-Precision Used Back-End Semiconductor Die Bonding Machine Asm Ca2 Die Bonder
US$30,000.00-40,999.00
1 Piece(MOQ)