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dB100 Series High Precision Die Bonder Solution
US$30,999.00
1 Set
Product profile
After-sales Service
Online and Video ServiceCondition
NewSpeed
Medium SpeedModel NO.
DB100Precision
High PrecisionCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
SemiautomaticType
Medium-speed Chip MounterMax. Chip Size
Smaller 20mm X20mm(50*50mm Optional)Min. Chip Size
0.2*0.2mmMounting Precision
±3um 3δFeeding Mode
2 Inch Waffle Box*2Substrate Size
150*150mmX Y Z Axis Motion System
Roller Screw + Servo MotorX Y Axis Resolution
0.1umPower Supply
220V, 50HzNet Weight
150kgTransport Package
Polywood CaseSpecification
800 * 750 * 630mmTrademark
TERMWAYOrigin
Beijing, ChinaKey features
Sub-Micron Precision: Marble motion platform ensures sub-micron level accuracy with 1um placement precision.
Advanced Laser Measurement: Integrated laser height measurement system for deep cavity substrate and eutectic welding.
Versatile Optional Modules: Supports nozzle heating, UV curing, nitrogen protection, and substrate preheating modules.
High Precision Bonding: Ideal for high-end medical equipment, optical devices, and semiconductor chip assembly.
Flexible Chip Handling: Handles chips from 0.2x0.2mm to 20x20mm with manual nozzle replacement options.
Stable Performance: Semiautomatic design with high cost-performance ratio for R&D and small batch production.
Comprehensive Calibration: Features visual calibration and high-precision visual alignment systems for accuracy.
ISO and CE Certified: Meets international safety and quality standards with ISO and CE certifications.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading CompanyExport Year: 2012-04-10 CertifiedNearest Port: Tianjin PortAverage Response Time: ≤24h CertifiedTerms of Payment: LC, T/T CertifiedInternational Commercial Terms(Incoterms): FOB, CIF
About Our Factory & Business Background
Address12i Factory Building, No 15, Jingsheng South 4th Street, Jinqiao Science and Technology Industrial Base, Zhongguancun High-Tech Park, Tongzhou District, Beijing
Plant Area1100 square meters
Number of Employees28
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsPCB Assembly, Pick&Place Machine, Reflow Oven/Wave Machine, Screen Printer, Dispenser
Production MachinesDial indicator, Bench driller, Multimeter, AOI tester
R&D Engineers6 people
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2012-07-31
Main MarketsNorth America, Europe, East Asia(Japan/ South Korea)
Number of Foreign Trading Staff5
Overseas Agent/BranchYes
Product Q&A
Q:What is the placement accuracy of the DB100?
A:
The placement accuracy can reach 1um depending on the specific configuration.
Q:What chip sizes can the machine handle?
A:
It supports chip sizes from 0.2x0.2mm up to 20x20mm (50x50mm optional).
Q:What optional modules are available?
A:
Options include nozzle heating, pressure feedback, UV curing, nitrogen protection, substrate preheating, and chip flip placing modules.
Q:What is the warranty period?
A:
The machine comes with a 12-month warranty.
Q:What is the average lead time?
A:
The average lead time is one month for both peak and off-season periods.
Send Inquiry
*To:Termway (Beijing) Precision Technology Co., Ltd.
Termway (Beijing) Precision Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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