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High-Precision COB Die Bonder for SMD LED Assembly
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
YesCondition
NewModel NO.
DB001Speed
High SpeedPrecision
High PrecisionWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterPlacement Accuracy
±50µM @3σTheta (Rotational) Accuracy
±3° @3σThroughput
up to 20 Clips/CycleBonding Process Control
Prebond & Postbond FunctionsClip Punching System
Accurate Clip Formation and FeedingMulti-Dispensing System
Glue Volume Detection Automatic RefillingDispensing
Multi-System + InspectionApplication
Power DevicesTransport Package
Air FreightSpecification
customizedTrademark
HimalayaOrigin
ChinaProduction Capacity
200Key features
High Throughput Speed: Up to 20 clips per cycle with a die bond cycle as fast as 180ms.
Flexible Customization: Configurable options include crystal rings, dispensing heads, and glue plates.
Advanced Dispensing System: Multi-system with glue volume detection and automatic refilling.
Comprehensive Warranty: 12-month warranty coverage for all mechanical equipment.
24/7 Technical Support: Professional online technical support available 24 hours a day.
Patented Head Design: Brand-new tying head design ensures accurate positioning and stable operation.
Versatile Application: Suitable for SMD, 1W COB, and various flat support products.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.07h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Does the machine support customization?
A:
Yes, you can flexibly choose different configurations such as four crystal rings, double dispensing heads, and double glue plates.
Q:What is the maximum throughput capacity?
A:
The machine can process up to 20 clips per cycle.
Q:What kind of technical support is provided?
A:
We provide 24 hours online professional technical support along with a one-year warranty.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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