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Next-Generation Laser Epitaxy System for Superior Material Synthesis
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
7*24 HoursFunction
Abrasion Resistance, High Temperature ResistanceModel NO.
EG-01Demoulding
Pull CoreCondition
NewCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
<300,000 ShotsProduct Name
Laser Induced Epitaxial Growth MachineFeature 1
Modulation TechnologyFeature 2
High ProductivityOEM/ODM Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
First Domestic 12 Inch Mass Production: Advanced laser epitaxy system for high-quality material development.
High Precision Beam Technology: Multi-laser rectangular top-hat beam with large size and high productivity.
High Energy Density Accuracy: Energy density accuracy down to 5mJ/cm2 for precise processing.
Amorphous Silicon Processing: Laser-induced epitaxial growth and void elimination in ultra-small vias.
Comprehensive After-Sales Service: 7*24 hours support with 24 hours online professional technical assistance.
Flexible OEM/ODM Customization: OEM and ODM services provided for tailored machine solutions.
Robust Durability Features: Abrasion resistance and high temperature resistance for industrial use.
Certified Quality Standards: ISO and CE certified equipment ensuring safety and compliance.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.77h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the laser wavelength of the system?
A:
The laser wavelength is 532nm.
Q:What is the maximum wafer size supported?
A:
The system supports a wafer size of 12 inch.
Q:What is the focal depth range?
A:
The focal depth range is 5mm.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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