Powered by Made-in-China.com
Likesmile Semiconductor Silicon Wafer Grinding Machine Manufacturer
US$7,000.00
1-2 Pieces
US$6,500.00
3+ Pieces
Product profile
Customization
AvailableWarranty
1 YearType
Double Side Lapping MachineModel NO.
BWVoltage
380 VCNC or Not
CNCCore Components
PLCMachinery Test Report
ProvidedPower (Kw)
5.5Weight (Kg)
1800Machining Accuracy
High PrecisionApplicable Industries
Grinding IndustryInstallation Method
Floor-StandingGrinding Wheel Speed
3000(Rpm)Transport Package
1700*1300*2170(mm)Trademark
BWOrigin
Jiangsu, ChinaKey features
Integrated Grinding Process: Thinning machine achieves integrated rough and fine grinding for complete silicon wafer production lines.
High Precision Control: Adopts PLC, grating ruler, and servo control for fully closed-loop thickness control with high accuracy.
Stable Dual-Side Operation: Lower spindle switches between rough and fine grinding positions ensuring stable operation.
Flexible Customization: Offers full customization, minor customization, and flexible options from samples or designs.
One-Year Warranty: Comes with a 1-year warranty coverage for the equipment.
CNC Technology: Equipped with CNC system and 5.5 Kw power for efficient performance.
High Speed Grinding: Grinding wheel speed reaches 3000 Rpm for high efficiency.
Floor-Standing Design: Designed for floor-standing installation suitable for grinding industry applications.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.03h
About Our Factory & Business Background
AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsMechanical Equipment
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What is the warranty period?
A:
The machine comes with a 1-year warranty.
Q:Can the machine be customized?
A:
Yes, we offer full customization, minor customization, and flexible options based on samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What is the average lead time?
A:
The lead time is one month for both peak and off-peak seasons.
Q:What payment terms are accepted?
A:
We accept LC (Letter of Credit) as the term of payment.
Send Inquiry
*To:
Nanjing Likesmile New Energy Technology Co., Ltd.
Nanjing Likesmile New Energy Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Semiconductor Silicon Wafer Double Side Lapping Machine Manufacturer
US$6,500.00-7,000.00
2 Pieces(MOQ)
Semiconductor Silicon Wafer Grinding Machine Manufacturer
US$6,500.00-7,000.00
2 Pieces(MOQ)
Semiconductor Silicon Wafer Grinding Machine Exporter
US$6,500.00-7,000.00
2 Pieces(MOQ)
Semiconductor Silicon Wafer Double Side Grinding Machine
US$6,500.00-7,000.00
2 Pieces(MOQ)
Bench-Top Double Side Lapping Polishing Machine for Silicon Wafers
US$1,400.00-1,800.00
1 Piece(MOQ)
Acyclovir Ultrafine Pulverizer Manufacturer/High Efficiency Acyclovir Fine Grinding Machine
US$12,000.00-100,000.00
1 Set(MOQ)
Zst Laser Scriber Silicon Wafer Scribing Machine
US$10,000.00-12,000.00
1 Piece(MOQ)
Isharp Pusher Type Cutting Disc and Grinding Wheel Making Machine Manufacturer in China
US$2,000.00
1 Piece(MOQ)
Semiconductor Device Fabrication Fab Wafer Fab Mdhyds6m 6inch Dicing Saw for Semiconductor Industry High Precision Dicing Machine
US$46,000.00-183,500.00
1 Piece(MOQ)
Semiconductor Wafer Scribing Machine Dicing Saw High Precision Wafer Dicing Machine
US$46,000.00-183,500.00
1 Piece(MOQ)
Silicon Wafer Slicing Machine 30W Laser Auto Solar Cell Cutting Machine
US$13,000.00-15,000.00
1 Piece(MOQ)
Automatic Aluminium Foil Silicon Paper Rewinding Machine Manufacturer
US$1,500.00-25,000.00
1 Set(MOQ)
Light Calcium Carbonate Ultrafine Grinding Mill PCC Powder Making Machine Manufacturer
US$12,000.00-100,000.00
1 Set(MOQ)
Semiconductor Device Fabrication Wafer Fab Beol Feol Dicing Saw Machine for Wafer Cutting High Percision CE
US$47,000.00-63,000.00
1 Piece(MOQ)
Corn Soya Blend Porridge Grinder Nutrition Rice Powder Grinding Machine Instant Rice Grinding Machine Manufacturer
US$1,000.00-5,500.00
1 Set(MOQ)
Silicon Wafer Cutting Machine with Fiber Laser Small Solar Panel Machine
US$13,000.00-15,000.00
1 Piece(MOQ)
China Professional Manufacturer Silicon Paper Rewinding Machine
US$1,500.00-20,000.00
1 unit(MOQ)
Likesmile IC Wafer Edge Grinding Machine Supplier for Semiconductor Industry
US$7,000.00
1 Piece(MOQ)
Solar Machine Manufacturer Solar Cell Laser Cutting Equipment
US$13,000.00-15,000.00
1 Piece(MOQ)




