Powered by Made-in-China.com
Automatic Thick Aluminium Wire Bonding Machine Wire Bonder for to-220 to-3
US$45,000.00-65,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MDAWB-3721Speed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTransport Package
Wooden CrateSpecification
1000kgTrademark
minder-hightechOrigin
ChinaProduction Capacity
1000Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤11.33h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
AI-Powered supplier vetting
SummaryGuangzhou Minder-Hightech Co., Ltd, established in 2014 in Guangdong, China, operates as a trading company with a focus on industrial equipment and components. Despite being a limited company with only 10 employees, it has maintained a strong relationship with high-profile companies like Bosch and Apollo, suggesting robust industry connections. The company exports a significant portion of its products to Europe and North America, which constitutes 41-50% of its total sales. However, it lacks formal certification in supplier management systems and has limited R&D resources. With an annual production output of approximately US$1-2.5 million, it operates eight production lines but does not hold certifications, which could be a limitation in quality assurance.
Supplier typeGuangzhou Minder-Hightech Co., Ltd is classified as a trading company and operates as a limited company.
CertificationsThe company does not hold any certifications for supplier management systems.
R&D capabilityDespite being a relatively new company, it claims over 20 years of experience in welding technology and maintains relationships with high school scientific research institutions.
Production capacityThe company operates eight production lines with a total manufacturing area of 260.0m² and an annual production output between US$1-2.5 million.
Client casesThe company has collaborated with prominent firms such as Bosch and Apollo, indicating established customer cases.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
Manual Semi-Automatic Wire Bonding Machine Wire Bonder for ECU Icbt Semiconductor
US$51,000.00-80,000.00
1 Piece(MOQ)
Scientific Research Small Batch Automatic Desktop Wire Ball Bonder Bonding Machine
US$7,000.00-30,000.00
1 Piece(MOQ)
Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA
US$7,000.00-70,000.00
1 Piece(MOQ)
Asm Automatic Gold Wire Ball Bonding Machine Suppliers Eagle-Aero-Gocu Wire Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Manual Semi-Automatic Deep Cavity Wedge or Gold Ball Wire Bonder Bonding Machine
US$51,000.00-80,000.00
1 Piece(MOQ)
New Asm Automatic Wire Bonding Machine Manufactures Eagle-Aero-Gocu Wire Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Gkg Gd601d Full-Automatic High-Speed Die Bonder - 180° Cross Bonding, in-Line Sheet-to-Sheet Transfer
US$32,500.00-58,000.00
1 Piece(MOQ)
Desktop High Precision Semi-Automatic Die Bonder Crystal Bondering Machine Db100
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd612 Roll-to-Roll Die Bonder with 12-Inch Automatic Film Expanding Function
US$12,500.00-38,000.00
1 Piece(MOQ)
Asm Ihawkv Automatic Wire Bonding Machine Supplier Eagle-Aero-Gocu Gold Wire Ball Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Laboratory Packaging Equipment Wire Bonding Machine Manual-Semi Ball Wedge Wire Bonder
US$51,000.00-80,000.00
1 Piece(MOQ)
Asm Automatic Silver Wire Ball Bonding Machine Manufactures Eagle-Aero-Gocu Wire Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Small Die Bonder Die Pick and Place Machine for Wafer
US$90,500.00-119,000.00
1 Piece(MOQ)
Advanced Precision Automatic Clip Chip Bonder for Semiconductor Production
US$10,000.00-100,000.00
1 Piece(MOQ)
dB100s Submicron Pick and Place Machine Die Bonder with Flip Chip
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg High-Speed Die Bonder Series: Flexible Sheet/Tape Model & Full-Automatic Gd602D - 180° Cross Bonding, in-Line
US$32,500.00-58,000.00
1 Piece(MOQ)
Semiconductor High-Precision Fine Aluminum Wire Bonding Machine Used Hesse Bj855 Wire Bonder
US$19,999.00-23,999.00
1 Piece(MOQ)
High-Precision Linear Die Bonder for Optimal Bonding Performance
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Small Semiconductor Die Bonding System, Wafer Die Attach Eutectic Bonder dB100
US$90,500.00-119,000.00
1 Piece(MOQ)