Powered by Made-in-China.com
Thermo Compression Die Bonding or Die Attach Machine / Thermal Compression Bonder
US$790,000.00-850,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MDSY-TCB30Speed
Super High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterTransport Package
Wooden CaseTrademark
minder-hightechOrigin
ChinaProduction Capacity
10000Key features
Ultra High Speed: Approximately 12 seconds per cycle for efficient mass production.
Multi-Function Bonding: Supports thermal compression, ultrasonic, eutectic, and regular bonding.
Wide Applicability: Handles chip sizes from 0.3mm to 30mm with various substrate materials.
Smart Process Control: Records bonding parameters like pressure, temperature, and ultrasonic data.
Flexible Configuration: Supports 2-inch and 4-inch trays with free setting for chips or substrates.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.62h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period for the equipment?
A:
The equipment has a 12-month warranty period. After the warranty, damaged parts are charged at cost price.
Q:What after-sales services are provided?
A:
Technical engineers are available online for installation, debugging, and maintenance. On-site service is available for special equipment with a separate quote.
Q:How is the payment structured?
A:
A deposit is required after plan confirmation. The balance is paid after the equipment is ready, followed by shipment.
Q:Can sample production be provided?
A:
Yes, sample production services are available, but some fees may apply.
Q:What is the delivery and inspection process?
A:
An acceptance video is sent after manufacturing. Customers can also visit the site to inspect the equipment before shipment.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Semiconductor Packaging Die Bonder Bonding Machine Eutectic Crystal Planting Machine
US$50,000.00-100,000.00
1 Piece(MOQ)
Asm Semiconductor Equipment Manufacturers Cm Linda Automatic Bonding Machine Supplier Die Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Small Semiconductor Die Bonding System, Wafer Die Attach Eutectic Bonder dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
Small Semiconductor Die Bonding System Wafer Die Attach Eutectic Bonder
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Manual Semi-Automatic Deep Cavity Wedge or Gold Ball Wire Bonder Bonding Machine
US$51,000.00-80,000.00
1 Piece(MOQ)
Asm Ad830 Plus Die Bonding Machine Semiconductor Equipment Asmpt Die Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Besi 2200 Equipment Supplier Die Bonding Machine Manufacture Die Bonder
US$19,999.00-69,999.00
1 Piece(MOQ)
Small Die Bonder Die Pick and Place Machine for Wafer
US$90,500.00-119,000.00
1 Piece(MOQ)
Ad832I Fully Automatic Asm Die Bonding Machine, Semiconductor Die Bonder for IC Packaging Production
US$100,000.00-120,000.00
1 Piece(MOQ)
Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA
US$7,000.00-70,000.00
1 Piece(MOQ)
Besi 2200 Die Bonding Machine Manufacture Die Bonder
US$19,999.00-69,999.00
1 Piece(MOQ)
Micro LED Mini LED Semiconductors Mems Devices RF Microwave Hybrid Circuits Desktop Die Bonder Die Attach Mounter Chip Bonding Placement
US$116,000.00-150,000.00
1 Piece(MOQ)
Desktop High Precision Semi-Automatic Die Bonder Crystal Bondering Machine Db100
US$90,500.00-119,000.00
1 Piece(MOQ)
Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder
US$7,000.00-70,000.00
1 Piece(MOQ)
Small High Precision Pick and Place Machine Flip Chip Die Bonder dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
Semiconductor Equipment Automatic Besi Flip Chip Wedge Wire Bonding Machine Datacon 2200 Evo Series Die Bonder
US$147,000.00-272,000.00
1 Piece(MOQ)
Right M90-L Fully Automatic Die Bonder High Precision LED PCB Chip Mounting Machine
US$22,500.00-38,000.00
1 Piece(MOQ)
Gkg Gd612 Precision Die Bonder - Flexible Roll-to-Roll Die Bonding Equipment with 12-Inch Auto Film Expanding
US$12,500.00-38,000.00
1 Piece(MOQ)