Powered by Made-in-China.com
Ultra-Thin Chips Easily Broken High Precision Peeling Technology Ultra Thin Chip Die Sorter Die Sorting Machine
US$120,000.00-149,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MDND-120UTSpeed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterTransport Package
Wooden CaseTrademark
MINDER-HIGHTECHOrigin
ChinaProduction Capacity
1000Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.03h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Send Inquiry
*To:
Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
US$120,000.00-149,000.00
1 Piece(MOQ)
Advanced High-Speed Die Attach Machines for Precision Chip Assembly
US$40,000.00-100,000.00
1 Piece(MOQ)
Juki Rx-8 High Precision SMT Mounter 0201 Chip Mounting Machine Juki Planet Head Technology for R&D Production
US$50,000.00-58,000.00
1 Piece(MOQ)
Semiconductor Packaging Equipment High Precision Die Bonder Attach Die Bonding Machine
US$30,000.00-60,000.00
1 Piece(MOQ)
High Precision Die Bonding Machine for Semiconductor Chips
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic
US$50,000.00-100,000.00
1 Piece(MOQ)
High Precision Adaptable Packaging SMT Machine Chip Mounter with Die Attach System
US$20,000.00-50,000.00
1 model(MOQ)
High-Precision Automatic Die Attach Machine for Efficient IC Packaging
US$7,000.00-70,000.00
1 Piece(MOQ)
Used Samsung Sm-471 SMD Chip Mounter SMT Pick and Place Mounting Machine High-Speed, Precision Surface Mount Technology for PCB Assembly
US$14,000.00-18,000.00
1 Piece(MOQ)
Used Asm Siplace X4s Ultra-High Speed SMT Pick and Place Machine, 4-Gantry High Precision Chip Mounter for Semiconductor & Electronics Assembly
US$131,000.00-133,800.00
1 Piece(MOQ)
Ultra-High-Speed Modular SMT Chip Mounter Placement Machine
US$5,000.00-65,000.00
1 Piece(MOQ)
Samsung Brand SMD Pick and Place Machine Automatic SMT Chip Mounter with High Precision and Speed
US$70,000.00-135,000.00
1 Piece(MOQ)
Automatic High Precision PCB Making Machine SMT Machine Price SMD Pick and Place Machine SMT Chip Mounter SMT Placement Machine
US$18,000.00-20,000.00
1 Piece(MOQ)
Pick and Place Machine Juki Jx-350 and Chip Shooter with High Speed
US$72,000.00-89,000.00
1 Piece(MOQ)
High Precision SMT Panasonic Pick and Place Machine Cm602 Chip Mounter Cm602 SMT Machine
US$97,400.00-100,000.00
1 Piece(MOQ)
High Performance Juki Chip Shooter LED Bulb Light Making Machine
US$80,000.00-100,000.00
1 Set(MOQ)













