Fonda Third-Generation Semiconductor Materials Fully Automatic Wafer Thinning Machine

Name: Fonda Third-Generation Semiconductor Materials Fully Automatic Wafer Thinning Machine
Brand: Shenzhen Ponda Grinding Technology Co.,Ltd.
SKU: 2166227205

Guangdong, ChinaShenzhen Ponda Grinding Technology Co.,Ltd.

US$280,000.00-320,000.00

1 Piece

Sample price:US$300000.00/piece.Request sample

Product profile

Customization

Available

After-sales Service

Response Within 4 Hours, Reach The Scene Within 48

Warranty

Shelf Life 1 Year

Model NO.

FD-3005A

Type

Surface Grinding Machine

Processing Object

Curve

Abrasives

Grinding Wheel

Controlling Mode

Artificial

Automatic Grade

Semiautomatic

Cylindrical Grinder Type

Universal Cylindrical Grinder

Precision

High Precision

Certification

ISO 9001

Condition

New

Wheel Diameter

Medium 209 mm

Wheel R. Speed

500- 3000 Min-1

G. Wheel R.Speed

0-4000min

Vacuum Table R.Speed

0-300min

in-Feed Resolution

0.1-80um/S

Fast Traverse Speed

10mm/S

Max.Vacuum Pressure

-90 Kpa

Ttv

Less Than or Equal To3um

Surface Roughness

Ra0.015um

Total Power

7kw

External Dimension

1750×1250×1550

Total Weight

1000kg

No.of Vacuum Table

Applicable Wafer Size

2 To12-Inch Standard Wafer

Transport Package

Wood Crate

Specification

1200× 16150× 2400 mm

Trademark

PONDA

Origin

China

Production Capacity

500 Unit/Year

Company profile

Cooperated with Fortune 500Years of Export ExperienceExperienced TeamR&D Capabilities

Shenzhen Ponda Grinding Technology Co.,Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 18 years CertifiedNearest Port: Shenzhen Yantian PortAverage Response Time: ≤6.98h

AI-Powered supplier vetting

SummaryThe supplier integrates R&D, design, manufacturing, sales, and after-sales service, producing grinding equipment, accessories, and consumables for optical, electronics, mold, metal, and hardware applications. It reports 3D software design capability, multiple customization modes, and new products developed within the past year. Manufacturing includes five production lines, while quality control staffing is reported at 21–30 personnel. The company has 18 years of export experience, self-operated import/export rights, and markets covering Asia, Europe, Australia, North America, and domestic customers. Service procedures and corrective/preventive-action records exist, but complaint handling lacks written records. No overseas warehouse, showroom, agent/branch, or offline trade-show participation is reported. Financial records are identified for 2021–2023, but their results are not provided. Customer-specific cases and certifications are not evidenced.

Supplier typeThe supplier is a manufacturer and integrated industrial service provider: its stated scope includes production, sales, technology development, R&D, software services, import/export, and after-sales-related functions. Its products focus on grinding equipment, accessories, consumables, and applications across optical, electronics, molds, metal parts, and hardware.

R&D capabilityThe supplier reports integrated R&D and design functions, 3D software design services, ten years of total R&D engineer experience, and new product development during the past year. These details support an active product-development capability.

Production capacityThe supplier manufactures grinding equipment, accessories, and consumables and operates five production lines. It reports 21–30 quality-control staff, but does not continuously reconcile quantities for each batch or production volume, indicating a documented manufacturing-control weakness.

Customization capabilityThe supplier explicitly offers customization from samples and designs, full, minor, and flexible customization, together with 3D software design services. This demonstrates broad stated customization coverage.