Powered by Made-in-China.com
Gkg Gd91m2 Automatic Die Bonding Machine for Backlight & Display Module Manufacturing
US$12,500.00-38,000.00
1 Piece
Product specifications
Weight
Product profile
Customization
AvailableSpeed
High SpeedPrecision
High PrecisionModel NO.
GD91M2Certification
CCC, PSE, FDA, RoHSAutomatic Grade
AutomaticType
High-speed Chip MounterEquipment Type
Precision Die Bonding EquipmentDie Bonding Mode
Dual-Arm 180° Rotation Die BondingDie Bonding Accuracy
±0.03 mmRepeat Positioning Accuracy
±0.02 mm @ 3σMaximum Die Bonding Speed
4500 PCS/HPower Supply
AC 220V/380V, 50/60 Hz, 2.5 KwAir Supply
0.4 - 0.6 MPa Dry Compressed AirOperating Temperature
10 - 40 °COperating Humidity
30% - 60% Rh (No Condensation)Applicable Die Size
0.3 × 0.3 mm - 25 × 25 mmTransport Package
Wooden CaseTrademark
GKGOrigin
ChinaHS Code
8479896200Key features
High-Speed Production: Maximum die bonding speed reaches 4500 PCS/H for efficient manufacturing.
Multi-Adhesive Support: Compatible with silver glue, insulating glue, flux, and other die bonding adhesives.
Flexible Customization: Offers OEM/ODM services with flexible customization from samples or designs.
Wide Applicability: Suitable for backlight modules and large direct display applications.
Certified Quality: Holds CCC, PSE, FDA, and RoHS certifications for global market compliance.
Efficient Material Handling: Robotic arm feeding and tray output mode ensure smooth production flow.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.66hTerms of Payment: LC, T/T, D/P, etc.
AI-Powered supplier vetting
SummaryThe supplier is a Shenzhen-based factory in the manufacturing industry, focused on SMT equipment, spare parts, consumables, feeders, precision maintenance, calibration, jigs, and automated non-standard products. It demonstrates broad customization capability, OEM service for popular brands, documented complaint-handling and corrective-action procedures, and stated lead times within 15 working days in both peak and off-peak seasons. However, it has no supplier-management-system certification, no in-stock or overseas warehouse/showroom capability, no available SDK, no new products launched in the past year, and only one year of total R&D engineer experience is reported. Financial evidence is limited to year labels without substantive performance values, while customer coverage is described generally rather than through named cases.
Supplier typeThe supplier is identified as a factory located in Bao'an District, Shenzhen, within the manufacturing industry. Its stated activities cover SMT and semiconductor equipment support, spare parts and consumables, precision maintenance and calibration, jig production, and automated and electronic products.
CertificationsThe supplier-management-system certification field is explicitly recorded as NIL. This indicates no certification is evidenced for this field.
After-Sales capabilityThe supplier has clear procedures and followed records for corrective and preventive actions and customer complaint handling. Its service scope includes equipment relocation, maintenance, care, and precision calibration, while stated average peak and off-season lead times are within 15 working days.
Production capacityThe supplier operates as a manufacturing factory with a 600.0 m² plant and offers precision parts, jigs, automated non-standard products, SMT equipment support, and related products. It reports 80 qualified service suppliers and lead times within 15 working days, but has no in-stock capacity and no overseas warehouse or showroom.
Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, and flexible customization. Its product scope also includes precision parts, jigs, and automated non-standard products, directly supporting customized production needs.
Product Q&A
Q:What services do you provide?
A:
We are a professional supplier of SMT machines and spare parts based in Shenzhen, China. We supply a complete range of SMT equipment and support customized OEM & ODM services.
Q:What is your MOQ?
A:
We support 1 unit minimum order, and mixed orders are also acceptable.
Q:What are your payment terms?
A:
Full payment is required before shipment. One-time full payment or installment payment are both available.
Q:How long is your delivery time?
A:
Generally, goods will be delivered within 7 working days after receiving your full payment.
Q:What should I do if the machine has problems after delivery?
A:
Within the warranty period, we provide free replacement parts for any quality-related machine issues.
Send Inquiry
*To:
Shenzhen Tengxiangjia Technology Co., Ltd.
Shenzhen Tengxiangjia Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
High Precision IC Die Bonder Suneast Sdb200 Pre-Sintering Bonding Machine for Power Semiconductor Modules
US$12,500.00-38,000.00
1 Piece(MOQ)
High-Precision Automatic Die Bonding Machine for Semiconductor Manufacturing
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Gkg High-Speed Flexible Sheet/Tape Die Bonding Machine for Semiconductor Assembly
US$32,500.00-58,000.00
1 Piece(MOQ)
Gkg Gd91m6ls Advanced Die Bonding Machine with Visual Alignment for Display Manufacturing
US$32,500.00-38,000.00
1 Piece(MOQ)
12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly
US$7,000.00-70,000.00
1 Piece(MOQ)
High Speed Gkg Gd210 Die Bonding Machine for Optoelectronic & Display Module Production
US$22,500.00-48,000.00
1 Piece(MOQ)
Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging
US$7,000.00-70,000.00
1 Piece(MOQ)
High-Precision Automatic Die Bonding Machine for Semiconductor Applications
US$7,000.00-70,000.00
1 Piece(MOQ)
Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
US$140,000.00-220,000.00
1 Piece(MOQ)
Hanwha Hm520 Neo High-Speed Placement Modules for Streamlined Manufacturing Solutions SMT Pick and Place Machine
US$5,000.00-8,000.00
1 Set(MOQ)
Customizable Tec Manufacture Equipment Automatic Eutectic Patch Die Mounter Die Bonding Machine
US$50,000.00-100,000.00
1 Piece(MOQ)
Manual Eutectic Die Attach Machine / Submicron Semi-Automatic Eutectic Bonding Equipment
US$10,000.00-90,000.00
1 Piece(MOQ)
China Semiconductor Manufacturing High Frequency Cof Wire Bonder Cm Linda Asmpt Automatic Wafer Die Acf Bonding Machine
US$35,000.00-65,000.00
1 Set(MOQ)
China Semiconductor High Frequency Die Cof Manufacturing Equipment Asmpt Ab383 Fully Automatic Acf Wire Wafer Bonding Machine
US$45,000.00-68,000.00
1 Set(MOQ)












