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Advanced High Precision Die Bonder for Semiconductor Wafer Assembly
US$100,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Condition

New

Model NO.

SHD8120S

Speed

High Speed

Precision

High Precision

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Product Name

Semiconductor Equipment

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Flexible Customization: Customized according to needs with ODM and OEM services available.
Comprehensive Warranty: 12 months warranty coverage for all mechanical equipment.
High Speed Production: Throughput of 4-8K UPH with high-speed automatic operation.
Wide Compatibility: Supports wafer sizes from 8-inch to 12 inches with various chip dimensions.
Low Solder Void Rate: Achieves solder voids of 2% for single void and 5% for total chip area.
Advanced Gas Control: Utilizes mixed gas (15%H2+85%N2) for optimal bonding environment.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.34h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
0/4000

Supplier replies will be sent to your registered email

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