What is the minimum order quantity?

The Minimum Order Quantity is 1 Set.

Advanced Precision Die Bonding Machine for Optimal Soldering Solutions

Name: Advanced Precision Die Bonding Machine for Optimal Soldering Solutions
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2082855382

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$7,000.00-70,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Condition

New

Model NO.

DBE-01

Speed

Super High Speed

Precision

High Precision

Certification

RoHS, CE

Warranty

24 Months

Automatic Grade

Automatic

Type

Ultra High-speed Chip Mounter

Product Name

Die Bonding Machine

Item Number

SD8012

Suitable with

Pdfn,To252-8r,To220/247/3p, Photovoltaic Devices

Bonding Pressure

30-300g (Programmable)

Track Width

up to 70mm

Wafer Size

12/ 8/6 Inches

Tin Wire Diameter

0.25-1mm

Tin Delivery Mode

Sn, Write, Press (Optional)

Transport Package

Wooden Box by Sea Shipping

Specification

standard package

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

High-Speed Production: Achieves 6,000 to 9,000 units per hour for high-yield assembly.

Low Void Rate Soldering: Supports soft solder with void rates as low as 2% (single) and 5% (total).

Flexible Material Handling: Compatible with 6/8/12-inch wafers and various lead frame packages like PDFN.

Programmable Bonding Force: Bonding pressure adjustable from 30g to 300g for delicate control.

RoHS & CE Certified: Equipment meets RoHS and CE certification standards for safety and quality.

OEM/ODM Customization: Offers OEM/ODM services and flexible customization options for specific needs.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.86h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing.

Q:What is the production speed of the machine?

The machine achieves a productivity of 6,000 to 9,000 units per hour.

Q:What wafer sizes are compatible with this equipment?

It is compatible with 12-inch standard wafers, and 8-inch and 6-inch wafers are optional.