What is the lead time for orders?

Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.

High-Precision Linear Die Bonder for Superior Bonding Efficiency

Name: High-Precision Linear Die Bonder for Superior Bonding Efficiency
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2126173285

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Condition

New

Speed

High Speed

Precision

High Precision

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Product Name

Semiconductor Equipment

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

High Precision Bonding: Features high-precision linear driven bond head and highly accurate die rotation system.

Dual Dispensing System: Equipped with intelligent dispensing control for precise glue volume control.

Wafer Size Compatibility: Supports wafer sizes ranging from 6 inches to 8 inches.

Customization Available: Offers customization for special designs according to specific needs.

Advanced Detection Function: Includes missing die detection and re-picking function for quality assurance.

12 Months Warranty: Provides a comprehensive one-year warranty period for the equipment.

24/7 Technical Support: Offers 24 hours online professional technical support during the warranty period.

ISO Certified: Product meets ISO certification standards for quality and safety.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What wafer sizes does the machine support?

The machine supports wafer sizes from 6 inches to 8 inches.

Q:Is customization available for this equipment?

Yes, customization for special designs is available according to customer needs.

Q:What are the main features of the dispensing system?

It features a dual dispensing system with intelligent control for precision glue volume.