Powered by Made-in-China.com
High-Precision Automatic Die Bonder for Efficient LED Packaging Solutions
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
SHD8120Speed
High SpeedPrecision
High PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
High Speed Output: Max 17K UPH depending on chip size and frame density.
Flexible Customization: Customized according to needs for product features and functions.
Comprehensive Warranty: 12 months warranty with 24 hours online technical support.
Wide Compatibility: Supports 12-inch wafers and chip sizes from 0.3mm to 4mm.
Advanced Vision System: 640x480 resolution with 0.25mil recognition accuracy.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.54h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the maximum bonding speed?
A:
The max speed is 17K UPH, variable depending on chip size and density of frame bonding.
Q:What wafer sizes are supported?
A:
It supports 12-inch wafers and is compatible with 8-inch wafers.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 Set.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Advanced Precision Automatic Clip Chip Bonder for Semiconductor Production
US$10,000.00-100,000.00
1 Piece(MOQ)
High-Speed LED COB Die Bonder for Efficient Assembly Solutions
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High Precision Asm Die Bonder Ad819 Dispensing Equipment for Semiconductor Packaging Solutions
US$10,000.00-1,000,000.00
1 Set(MOQ)
Semicon Equipment Advanced Packaging Line Desktop High Precision Multifunction Dispensing Dispenser and Die Attach Chip Bonder
US$116,000.00-150,000.00
1 Piece(MOQ)
Desktop High Precision Semi-Automatic Die Bonder Crystal Bondering Machine Db100
US$90,500.00-119,000.00
1 Piece(MOQ)
dB100 Series High Precision Die Bonder Solution
US$30,999.00
1 Set(MOQ)
High-Precision Linear Die Bonder for Optimal Bonding Performance
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Factory Direct Sales Asm High Speed LED Clip Wafer Die Bonder Ad50PRO
US$100,000.00-1,000,000.00
1 Set(MOQ)
Precision Automatic Wafer Die Bonder for High-Speed Assembly
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Semi Automatic Flip Chip Die Bonder Semiautomatic with High Precision Termway
US$90,500.00-119,000.00
1 Piece(MOQ)
Right M90-L Fully Automatic Die Bonder High Precision LED PCB Chip Mounting Machine
US$22,500.00-38,000.00
1 Piece(MOQ)
Desktop Die Bonder High-Precision Manual-Semi-Automatic dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd91m6 Multi-Station Die Bonder High Accuracy for Display Module Manufacturing
US$32,500.00-38,000.00
1 Piece(MOQ)
Mdnd-Adb700 High-Speed High Precision Stacked Chips Advanced Semiconductor Packaging Die Bonder
US$150,000.00-200,000.00
1 Piece(MOQ)
Semiconductor High Precision Asmpt Siplace Ca2 Plus Die Bonding and Flip Chip Placement Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Gkg Gd210 Precision Die Bonder - 10-Inch Auto Wafer Ring Changer & Film Expander for 600×510mm Large Substrate Semiconductor Packaging
US$22,500.00-48,000.00
1 Piece(MOQ)
China Used Besi Datacon 8800 FC Quantum Advx Manufactures Automatic Ball Wire Flip Chip Wedge Die Bonder
US$158,000.00-259,500.00
1 Piece(MOQ)
Used Combines Speed Precision Stability Automatic Semiconductor Equipment Asm Die Bonding Machine Ad8312 K&S Wedge Wire Bonder
US$29,000.00-58,800.00
1 Piece(MOQ)
Gkg Gd80+C Automatic Precision Die Bonder Lightweight Dual Swing Arm for LED & Semiconductor
US$12,500.00-38,000.00
1 Piece(MOQ)
High-Precision Used Back-End Semiconductor Die Bonding Machine Asm Ca2 Die Bonder
US$30,000.00-40,999.00
1 Piece(MOQ)