What are the payment terms?

We accept LC, T/T, PayPal, and Western Union.

What is the equipment size and weight?

The equipment size is 1350 x 2170 x 1750 mm, and the weight is 3 tons (excluding chiller).

High-Precision Laser Cutting Solutions for LED Wafer Production

Name: High-Precision Laser Cutting Solutions for LED Wafer Production
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2026794052

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$500,000.00-1,000,000.00

1 Set

Product profile

Customization

Available

After-sales Service

7*24 Hours

Function

High Temperature Resistance

Model NO.

Himalaya-28

Demoulding

Automatic

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Desktop

Driven Type

Electric

Mould Life

>1,000,000 Shots

Positioning Repeatability

≤ ±1 Um (Y-Axis)

Platform Straightness

≤ ±1 Um

Platform Flatness

≤ ±2 Um

Laser Type

UV Laser

Laser Power

≤ 15 W

X-Y Worktable Travel

300 × 600 mm

Transport Package

Wooden Pack

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Automatic Operation: Fully automatic loading, unloading, gluing, and cleaning with unmanned operation capability.

Multi-Spot Cutting: Advanced multi-spot technology ensures efficient processing and controls material reflow.

Versatile Material Support: Suitable for 2, 4, and 6-inch silicon wafers, ceramics, and copper tungsten alloys.

Comprehensive Warranty: 12-month warranty coverage with 24/7 online professional technical support.

High-Speed Performance: Pulse frequency up to 500kHz and cutting speed of 250mm/s for high production capacity.

Flexible Customization: OEM and ODM services available with flexible customization options for specific needs.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.76h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What is the minimum order quantity?

The minimum order quantity is 1 set.

Q:What are the available customization options?

We offer flexible customization, including OEM and ODM services.

Q:What is the average lead time?

Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.