What is the maximum laser energy density?

The maximum energy density is 10J/cm2 for Green laser and 6J/cm2 for UV laser.

High-Precision Sic Laser Annealing System for Industrial Applications

Name: High-Precision Sic Laser Annealing System for Industrial Applications
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2081432662

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$70,000.00-100,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Function

Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion

Model NO.

SLM-01

Demoulding

Pull Core

Condition

New

Certification

ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Product Name

Sic Laser Annealing La

Feature 1

High Reliability and Stability

Feature 2

Independly Developped Optical System

OEM/ODM Service

Provided

Spot Size

X:100~500um

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

50000

Key features

Fully Autonomous Optical System: Independently developed optical system featuring LIET technology for high reliability.

Dual Wavelength Options: Optional IP Green and UV laser wavelengths to suit different processing needs.

High Mould Life: Capable of 300,000 to 1,000,000 shots for long-term industrial durability.

OEM and ODM Services: Flexible customization available with provided OEM/ODM services.

ISO and CE Certified: Meets international safety and quality standards with ISO and CE certifications.

Free Training Support: Complimentary training provided to ensure efficient machine operation.

High Precision Spot Size: Precise spot size ranging from 100 to 500 micrometers for detailed work.

Automatic Grade: Fully automatic electric driven operation for enhanced efficiency.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.22h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What are the available laser wavelengths?

The system offers optional IP Green and UV laser wavelengths.

Q:What wafer sizes does the machine support?

The equipment supports 6-inch and 8-inch wafer sizes.

Q:Is customization available for this product?

Yes, flexible customization is available along with OEM and ODM services.