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High-Speed LED Die Bonder for Efficient Semiconductor Production
US$60,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
SHD8120Speed
High SpeedPrecision
High PrecisionCertification
RoHS, ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterBonding Method
EpoxyPrecision (X/Y/θ)
≤±25um / <±3°Speed (Uph)
up to 17,000 (Chip-Dependent)Chip Size Range
0.3×0.3mm to 4×4mmChip Thickness
>75umMachine Size
1800×1490×1500mmWeight
1800 KgVision System
Image Recognition 256-Level GrayscaleTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
1000Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.00h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
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Jiangsu Himalaya Semiconductor Co., Ltd.
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