Is customization available?

Yes, we offer flexible customization and OEM/ODM design services according to your needs.

What are the payment terms?

We accept LC, T/T, PayPal, and Western Union.

What is the minimum order quantity?

The minimum order quantity is 1 set.

Next-Gen High-Speed Die Bonder for Semiconductor Manufacturing Efficiency

Name: Next-Gen High-Speed Die Bonder for Semiconductor Manufacturing Efficiency
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2083377962

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$70,000.00-100,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Online Service

Condition

New

Model NO.

DM-0291

Speed

High Speed

Precision

High Precision

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Product Name

Semiconductor Equipment

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

50000

Key features

Flexible Customization: Customized according to needs with OEM/ODM design available

Dual Dispensing System: Equipped with double dispensing and painting options

Large Wafer Compatibility: Supports 12-inch wafers and compatible with 8-inch wafers

Advanced Image Recognition: 256-level grayscale with 640x480 resolution and 0.25mil accuracy

Comprehensive Warranty: 12 months warranty with 24-hour online technical support

ISO Certified Quality: Manufactured under ISO certification standards for reliability

Precision Chip Handling: Handles chip sizes from 0.3mmx0.3mm to 4mmx4mm

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.14h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM Designing.

Q:What is the bonding speed capacity?

The maximum speed is 17K UPH, variable depending on chip size and density of frame bonding.

Q:What wafer sizes are supported?

The machine supports 12-inch wafers and is compatible with 8-inch wafers.