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Precision Semiconductor Wafer Dicing with Advanced Stealth Technology
US$200,000.00-500,000.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
1 YearFunction
High Temperature ResistanceModel NO.
SC_01Demoulding
AutomaticCondition
NewCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
DesktopDriven Type
ElectricMould Life
>1,000,000 ShotsOEM
YesFlatness of Cutter Face
≤0.002mmReach Accuracy
+0.003mmMinimum Measurement
0.5*0.5mmCentral System Function
Remove Machine Alarm ProcessingCutting Substrate
Si, Pkg, PCB etcFeature
High Detection CapabilitySignal Reading
AccurateSpindle Output Power
1.8kw(2.4kw)Spindle Speed Range
6000-60000rpmTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
1111Key features
High Yield Rate: Achieves yields exceeding 99.6% with minimal edge chipping and residue.
Full Automation: Unmanned operation with automatic loading, unloading, gluing, and cleaning functions.
Multi-Beam Technology: Enables high-speed, high-quality processing for superior throughput and efficiency.
Dual Cutting Modes: Supports both front-side tangent and back-side laser processing for flexible integration.
Wafer Compatibility: Fully compatible with 2-inch, 4-inch, 6-inch, and 8-inch wafer formats.
Advanced Vision System: High-precision CCD with infrared imaging enables micron-level positioning accuracy.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.58h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What is the warranty period for this equipment?
A:
We provide a 1-year warranty for all our mechanical equipment.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the payment terms accepted?
A:
We accept LC, T/T, PayPal, and Western Union.
Q:What is the lead time for production?
A:
Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.
Q:Does the machine support OEM and ODM services?
A:
Yes, both OEM and ODM services are available with flexible customization options.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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