What is the average lead time for production?

The average lead time is one month, regardless of peak or off-season periods.

What technical support is available after purchase?

Technical engineers are always online to provide installation, debugging, and maintenance services. On-site services are available for special and large equipment.

What is the maximum component size supported?

The machine supports component sizes ranging from 0.2mm to 25mm.

Manual Eutectic Chip Mounter Die Bonder Bonding Machine

Name: Manual Eutectic Chip Mounter Die Bonder Bonding Machine
Brand: Guangzhou Minder-Hightech co.,Ltd
SKU: 1988218341

Guangdong, ChinaGuangzhou Minder-Hightech co.,Ltd

US$35,000.00-60,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Condition

New

Model NO.

MDJL-GJJ0225

Speed

Medium Speed

Certification

Warranty

12 Months

Automatic Grade

Manual

Type

Medium-speed Chip Mounter

Transport Package

Wooden Crate

Specification

60kg

Trademark

minder-hightech

Origin

China

Production Capacity

1000

Key features

Integrated Dispensing & Bonding: Combines dispensing and patching functions to improve efficiency for multi-chip epoxy mounting.

Precision Z-Axis Control: Features 0.2um encoder resolution and 50mm travel for accurate component placement.

Soft Contact Suction Nozzle: Solves air bridge issues on sensitive surfaces like GaAs chips through soft contact technology.

Adjustable Bonding Pressure: Soldering head pressure 0-30g and nozzle pressure 0-100g, continuously adjustable.

Versatile Pattern Scribing: Automatically scribes single-point, rectangle, and rice character patterns for various devices.

Industrial Grade Computer: Powered by Intel Baytrail J1900 processor with 4GB DDR3 memory and 64GB SSD.

Wide Application Scope: Suitable for MEMS, RF devices, COB modules, sensors, and automotive electronics.

12-Month Warranty Coverage: Includes 1-year warranty with cost-price replacement for parts after warranty period.

Company profile

Guangzhou Minder-Hightech co.,Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤10.67h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China

Registered Capital1,000,000 RMB

Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder

R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30

Main MarketsNorth America, Europe

Overseas Agent/BranchNo

Product Q&A

Q:Is the bonding pressure customizable?

Yes, the soldering head pressure (0-30g) and nozzle bonding pressure (0-100g) are continuously adjustable. If other ranges are required, the spring suspension point can be adjusted.

Q:What is the warranty period for this machine?

The equipment has a 12-month warranty period. After the warranty, damaged parts are replaced at cost price.

Q:Does the price include installation and debugging?

No, a separate quotation is provided for the service fee. Engineers can be dispatched to install and debug the equipment after it arrives at your factory.

Q:What are the payment terms?

A deposit is required after the plan is confirmed. The factory prepares the goods, and the balance is paid before shipping once the equipment is ready.

Q:Can you provide sample production services?

Yes, we can provide sample production services, but you may need to pay some fees.