What payment terms are accepted?

We accept LC (Letter of Credit) and T/T (Telegraphic Transfer) as terms of payment.

Termway Submicron Desktop Multi-Functional Die Bonder/ Die Bonding Machine Db100

Name: Termway Submicron Desktop Multi-Functional Die Bonder/ Die Bonding Machine Db100
Brand: Termway (Beijing) Precision Technology Co., Ltd.
SKU: 2290129405

Beijing, ChinaTermway (Beijing) Precision Technology Co., Ltd.

US$90,500.00-119,000.00

1 Piece

Product profile

After-sales Service

Engineer at Site

Condition

New

Speed

Medium Speed

Model NO.

DB100A

Precision

High Precision

Certification

ISO, CE

Warranty

12 Months

Automatic Grade

Semiautomatic

Type

Medium-speed Chip Mounter

Max. Die Size

20mm X20mm(50*50mm Optional)

Min. Die Size

0.2mm * 0.2mm

Mounting Precision

±3um 3δ

Soldering Area

110*110mm

Feeding Mode

2 Inch Waffle Box*2

X Y Z Axis Motion System

Roller Screw + Servo Motor

X Y Axis Resolution

0.1um

Power Supply

220V, 50Hz

Net Weight

350kg

Transport Package

Polywood Case

Specification

800 * 750 * 630mm

Trademark

TERMWAY

Origin

Beijing, China

Key features

Sub-Micron Precision: Marble motion platform ensures sub-micron accuracy for high-precision chip assembly.

Versatile Module Options: Supports optional modules like UV curing, nitrogen protection, and nozzle heating for diverse needs.

Wide Application Scope: Ideal for medical imaging, optical devices, and semiconductor chips like MEMS and RF devices.

Flexible Die Size Support: Handles max die size of 20x20mm (50x50mm optional) down to 0.2x0.2mm.

Stable Performance: Semi-automatic design with high cost-performance ratio suitable for R&D and small batch production.

Advanced Motion System: Uses roller screw and servo motor for X, Y, Z axis motion with 0.1um resolution.

Certified Quality: Machine holds ISO and CE certifications ensuring safety and quality standards.

Company profile

Termway (Beijing) Precision Technology Co., Ltd.

Beijing, China

CertifiedBusiness Type: Manufacturer/Factory & Trading CompanyExport Year: 2012-04-10 CertifiedNearest Port: Tianjin PortAverage Response Time: ≤18h CertifiedTerms of Payment: LC, T/T CertifiedInternational Commercial Terms(Incoterms): FOB, CIF

About Our Factory & Business Background

Address12i Factory Building, No 15, Jingsheng South 4th Street, Jinqiao Science and Technology Industrial Base, Zhongguancun High-Tech Park, Tongzhou District, Beijing

Plant Area1100 square meters

Number of Employees28

Registered Capital1,000,000 RMB

Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsPCB Assembly, Pick&Place Machine, Reflow Oven/Wave Machine, Screen Printer, Dispenser

Production MachinesDial indicator, Bench driller, Multimeter, AOI tester

R&D Engineers6 people

Own BrandYes

Our Industry Experience & Global Business Record

Year of Establishment2012-07-31

Main MarketsNorth America, Europe, East Asia(Japan/ South Korea)

Number of Foreign Trading Staff5

Overseas Agent/BranchYes

Product Q&A

Q:What is the maximum chip size supported?

The standard DB100 supports a maximum chip size of 20mm x 20mm. An optional configuration allows for up to 50mm x 50mm.

Q:What optional modules are available?

Optional modules include nozzle heating, nozzle pressure feedback, UV dispensing/curing, nitrogen protection, substrate preheating, process monitoring, and chip flip placing.

Q:What is the warranty period?

The machine comes with a 12-month warranty. After-sales service includes engineer support at the site.

Q:What are the main applications for this machine?

It is suitable for high-precision adhesive bonding in medical equipment, optical devices (laser LD, VCSEL), and semiconductor chips (MEMS, RF, microwave devices).

Q:What is the lead time for production?

The average lead time is one month for both peak season and off-season periods.