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Advanced High-Efficiency Wire Bonder for Precision Device Packaging
US$70,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
7*24 HoursCondition
NewModel NO.
WDM-01Speed
High SpeedPrecision
PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterWire Cutter
Front Cut / Rear CutWire Feed System
Motorized with High Resolution Encoder FeedbackWire Loss Detection
Encoder and Bond Power Detection MethodMaximum Wire Length Tracking
Real-Time MonitoringBond Force
Aluminum Wire: 50g - 1500gPower Supply
200-240V AC, 50-60 Hz, 2000WWeight
900 KgWork Area
X Axis: 300 mmY Axis
300 mmTransport Package
CrateSpecification
960mm (L) x 1400mm (W) x 1700mm (H)Trademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
High-Speed Performance: Cycle time under 1 second per wire for mass production efficiency.
Versatile Wire Compatibility: Supports aluminum, copper, and ribbon wires with forces up to 8000g.
Real-Time Monitoring: Encoder feedback and wire loss detection prevent defects and downtime.
Large Work Area: 300mm x 300mm X-Y travel for handling large substrates and multiple devices.
Robust Stability: 900kg heavy-duty frame ensures vibration damping and high precision.
Flexible Wire Cutter: Configurable front or rear cut options for optimal loop formation.
Adjustable Ultrasonics: 60kHz or 80kHz transducers with 30W-100W power for various materials.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.00h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What types of wire and materials can this machine bond?
A:
This machine is highly versatile and is specifically designed to handle a wide range of bonding wires, including round aluminum wire (5-20 mil), heavy copper wire (requiring up to 8000g of force), and ribbon wire (from 20x4 mil to 80x10 mil). This makes it suitable for everything from delicate integrated circuits to high-power devices.
Q:How does the machine ensure consistent quality and detect problems?
A:
It features advanced real-time process monitoring. The key systems are: Encoder Feedback: Precisely controls wire feed length for consistent loops. Wire Loss Detection: Combines encoder data and ultrasonic power monitoring to instantly detect wire breaks or feed issues, stopping the machine to prevent defects. Bond Power Monitoring: Analyzes the ultrasonic energy signature to identify poor bonds as they happen.
Q:Is this machine suitable for high-volume production?
A:
Yes, absolutely. With a rapid cycle time of less than 1 second per wire and a large 300mm x 300mm work area that minimizes substrate handling, it is built for high-throughput manufacturing. Features like motorized wire feed and real-time monitoring maximize uptime and yield.
Q:What is the warranty period for this equipment?
A:
The equipment comes with a 12-month warranty covering mechanical defects.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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