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Advanced Ultrasonic Wedge Bonder for Precision Welding Applications
Negotiable
1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Condition

New

Speed

Super High Speed

Precision

High Precision

Certification

RoHS, CE

Warranty

24 Months

Automatic Grade

Automatic

Type

Ultra High-speed Chip Mounter

Product Name

Wedge Bonder Equipment

Feature

Uph,Mtba

Item Number

Powerf-PS

Transport Package

Wooden Box by Sea Shipping

Specification

standard package

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

Enhanced Image Recognition: Optimized capabilities reduce downtime and improve MTBA with faster recognition speed.
Flexible Configuration: Supports single or double welding heads with interchangeable thick, thin, and strip heads.
Customized Arc Capability: Provides special arc shapes for critical applications to greatly improve welding consistency.
Online Non-Destructive Testing: Includes tensile testing system (20-500g) and wire arc height check options.
Global Parameter Editing: Allows batch modification of parameter settings for the same wire diameter in the program.
CE and RoHS Certified: All equipment meets CE certification standards and RoHS compliance requirements.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.14h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing.
Q:What are the available models?
A:
Himalaya is available in two models: TL for single-row to four-row TO power discretes, and HL for advanced power packaging.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 Set.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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Supplier replies will be sent to your registered email

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