Powered by Made-in-China.com
Advanced Packaging Multi Chip High-Precision CCD Gantry Automatic Glue Dispensing Eutectic Bonding Die Attach Eutectic Crystal Planting Die Bonder Machine
US$125,000.00-150,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MD 800Speed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTransport Package
Wooden CaseTrademark
minder-hightechOrigin
ChinaProduction Capacity
100000Key features
Advanced CCD Recognition: Binocular CCD system capable of recognizing chips as small as 0.1mm x 0.1mm.
Eutectic Bonding Capability: Supports COB/COC processes with heating eutectic process and adhesive solidification.
Precise Temperature Control: Temperature control accuracy reaches 1% with fast response and fault diagnosis.
Automated Material Handling: Compatible with 2-inch chip boxes, 6-inch, and 8-inch wafers for automated loading.
Robust Gantry Structure: Marble pedestal and large span dual drive gantry ensure high stability and precision.
Flexible Configuration: Optional assembly line tracks, wafer warehouses, and eutectic stages for continuous production.
Comprehensive Warranty: 12-month warranty with cost-price replacement for parts after warranty period.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.89h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period for the equipment?
A:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
Q:Can the machine handle different wafer sizes?
A:
Yes, chip incoming materials are compatible with standard 2-inch chip boxes, 8-inch, and 6-inch wafers, achieving automated loading and unloading functions.
Q:How is the temperature controlled during eutectic bonding?
A:
It uses thermocouple closed-loop control with online real-time feedback, achieving 1% accuracy. It supports segment control, fast response, and has fault diagnosis functions.
Q:What is the minimum chip size the CCD can recognize?
A:
The binocular CCD system is capable of self-recognition with a minimum chip size of 0.1mm x 0.1mm.
Q:Is installation and debugging service provided?
A:
Yes, after the equipment arrives at your factory, we can dispatch engineers to install and debug it. A separate quotation will be provided for this service fee.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
Used Asm Siplace Tx2 Compact High Speed SMT Pick and Place Machine, Dual-Gantry High Precision Chip Mounter for High-Mix Electronics Assembly
US$124,000.00-127,700.00
1 Piece(MOQ)
Juki Rx-7 High Precision SMT Pick and Place Machine, Automatic SMD Chip Mounter for 0201, Qfn, BGA Components
US$64,900.00-69,900.00
1 Piece(MOQ)
Advanced Semiconductor Packaging Multifunctional High Precision Thickness Minimum 50um Ultrathin Die Sorting Die Sorter Machine
US$120,000.00-149,000.00
1 Piece(MOQ)
Advanced Semiconductor Packaging Equipment Accuracy 1um Gantry Multi Needle Nozzle Replacement Die Sorter Die Sorting Attach Machine
US$170,000.00-190,000.00
1 Set(MOQ)
High-Precision Automatic Die Attach Machine for Efficient IC Packaging
US$7,000.00-70,000.00
1 Piece(MOQ)
Advanced High-Speed Die Attach Machines for Precision Chip Assembly
US$40,000.00-100,000.00
1 Piece(MOQ)
SMT Pick and Place Machine, Multi-Axis Automatic Placement Machine, SMT Placement Machine, Sm481 PRO Chip Mounter
US$5,000.00-65,000.00
1 Piece(MOQ)
Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging
US$7,000.00-70,000.00
1 Piece(MOQ)
Panasonic Npm-D3a Advanced Chip Mounter with Original Feeders High Accuracy Multi Functional SMT Pick and Place Machine
US$5,000.00-8,000.00
1 Set(MOQ)
Advanced Semiconductor Packaging University Teaching Research Eutectic Crystal Planting Machine
US$69,000.00-105,000.00
1 Piece(MOQ)
Advanced Flexible SMT Samsung Chip Mounter Sm471plus LED Chip Shooter Pick Place Machine
US$50,000.00-65,000.00
1 Set(MOQ)
Juki Rx-8 High-SMT Soldering Machine - Automatic Soldering and Suction Machine SMD Adhesive Tape and Roll Packaging Machine
US$80,000.00-100,000.00
1 Piece(MOQ)
GDK Automatic 6 Spindes X 1 Gantry Pick and Place Machine High Speed Placement Machine Galaxy
US$2,000.00-10,000.00
1 Set(MOQ)
Advanced Die Attach Machine for Versatile Packaging Solutions
US$70,000.00-100,000.00
1 Piece(MOQ)
