Powered by Made-in-China.com
Advanced Semiconductor Packaging University Teaching Research Eutectic Crystal Planting Machine
US$69,000.00-105,000.001 Piece
Advanced Semiconductor Packaging University Teaching Research Eutectic Crystal Planting Machine
US$69,000.00-105,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
RYW-ETB05BSpeed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTransport Package
Wooden CaseTrademark
Minder-hightechOrigin
ChinaKey features
Versatile Bonding Processes: Supports flip-chip, ultrasonic gold ball, laser, eutectic, and dispensing bonding.
Modular Design: Features flexible configuration and modular design for various applications.
Wide Application Scope: Suitable for Micro LED, MEMS, sensor packaging, and 3D packaging processes.
12-Month Warranty: Comes with a 12-month warranty period covering mechanical defects.
On-Site Technical Support: Engineers available for installation, debugging, and maintenance services.
CE Certified: Equipment meets CE certification standards for safety and compliance.
Dual Language Interface: Features a Chinese-English interface for ease of operation.
Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤9.14h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:Are your prices negotiable?
A:
All prices are competitive and negotiable, varying based on configuration and customization complexity.
Q:Do you provide sample production services?
A:
Yes, we can provide sample production services, though some fees may apply.
Q:What is the payment process?
A:
After plan confirmation, a deposit is required. The balance is paid after equipment is ready, followed by shipping.
Q:How is delivery handled?
A:
After manufacturing, we send an acceptance video. You may also visit the site to inspect the equipment.
Q:Do you offer installation and debugging services?
A:
Yes, we dispatch engineers to install and debug the equipment upon arrival. A separate quotation applies for this service.
Send Inquiry
*To:
Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
0/4000
Supplier replies will be sent to your registered email
You may also like
Tri Tr7900q Sii 3D Semi Aoi Machine 2.5μm High Resolution Inline Automatic Optical Inspection for Semiconductor Advanced Packaging
US$16,000.00-21,000.00
1 Piece(MOQ)
Thermo Electric Cooling Tec Semiconductor Cold Plate Die Bonding Chip Mounter Eutectic Crystal Planting Machine
US$50,000.00-100,000.00
1 Piece(MOQ)
Advanced Die Attach Machine for Versatile Packaging Solutions
US$70,000.00-100,000.00
1 Piece(MOQ)
Semiconductor Packaging Ad832I Fully Automatic Die Bonding Machine
US$100,000.00-120,000.00
1 Piece(MOQ)
Asm Ad832I Fully Automatic Die Bonder, High Speed Semiconductor Packaging Machine
US$100,000.00-120,000.00
1 Piece(MOQ)
Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging
US$7,000.00-70,000.00
1 Piece(MOQ)
Used Asm Wire Bonder High Precision Automatic Semiconductor Die & Wire Bonding Machine for SMT Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
Advanced Precision Wire Bonding Machines for Semiconductor Production Equipment
US$7,000.00-70,000.00
1 Piece(MOQ)
Advanced LED Die Bonding Machine for Precision Chip Manufacturing Equipment
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Advanced Premium Excellent Stability Fast Production Printing Machine
US$20,000.00
1 Piece(MOQ)
Advanced Automated Efficiency Manufacturing Industrial Professional Electronic Printing Machine
US$18,000.00-20,000.00
1 Piece(MOQ)
Juki Jm-100 Advanced Automated Insertion Machine for DIP Line
US$90,000.00
1 Piece(MOQ)
Advanced Chip Mounter Yrm10 SMT Pick and Place Machine for PCB Assembly Electronics Manufacturing
US$8,000.00-10,000.00
1 Set(MOQ)
KOH Young 3D Aoi Automatic Semiconductor Equipment Online Inspection Machine
US$125,000.00
1 Piece(MOQ)
YAMAHA Advanced Modular SMT Machine for PCB Assembly
US$85,000.00-95,000.00
1 Piece(MOQ)
Advanced T8 Machine for Precision Manufacturing and Assembly
US$13,000.00
1 Piece(MOQ)
YAMAHA Yrm20 Advanced SMT Placement Machine for Efficient PCB Manufacturing Production
US$8,000.00-10,000.00
1 Set(MOQ)









