What is the minimum order quantity?

The minimum order quantity is 1 set.

What are the payment terms?

We accept LC, T/T, PayPal, and Western Union.

High-Precision Wafer Die Bonder for Reliable Dispensing Solutions

Name: High-Precision Wafer Die Bonder for Reliable Dispensing Solutions
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2126430225

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$300,000.00-400,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Condition

New

Model NO.

SHD8120S

Speed

High Speed

Precision

High Precision

Certification

RoHS, ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Type

Ultra High-speed Chip Mounter

X/Y/θ Accuracy

±0.035mm, ≤±3°

Uph (Units/Hour)

4,000–8,000

Soldering Head Load

30g–300g

Loading Method

Wafer Stacking + Tray

Frame Size Range

L: 110–300mm, W: 12–100mm, H: 0.1

Chip Size Range

0.5 × 0.5mm – 14 × 14mm

Wafer Size

12 Inch

Tin Wire Diameter

0.25–1mm

Heating Track

8 Zones; Max 450°C (±3°C)

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Flexible Customization: Supports OEM/ODM and flexible customization for frame and chip sizes.

Low Solder Voids: Ensures high quality with solder voids limited to 2% (single) and 5% (total).

Comprehensive Warranty: Provides 12-month warranty with 24-hour online professional technical support.

Wide Compatibility: Handles chip sizes from 0.5x0.5mm to 14x14mm and 12-inch wafers.

Certified Quality: Equipped with RoHS, ISO, and CE certifications for global compliance.

Reliable Data Tracking: Includes Y data statistics and records for full process traceability.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.40h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing service.

Q:What customization options are available?

We offer flexible customization, including OEM/ODM services, to tailor the machine to specific frame sizes and chip requirements.

Q:What certifications does the equipment have?

The equipment is certified with RoHS, ISO, and CE standards.