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Wedge bonder manufacturers

I have found results from400+products and200+suppliers aboutWedge bonder

Guangzhou Minder-Hightech co.,Ltdmic-icon
Satisfies 1/1 of your requirement
Advanced Packaging Automatic Deep Access Wedge Wire Bonder Wire Bonding Machine

Advanced Packaging Automatic Deep Access Wedge Wire Bonder Wire Bonding Machine

US$100,000.00-130,000.00
1 Piece(MOQ)
Lab Semiconductor Device Silicon Aluminum Wire Chip Bonding Machine Heavy Wire Wedge Welding Wire Bonder

Lab Semiconductor Device Silicon Aluminum Wire Chip Bonding Machine Heavy Wire Wedge Welding Wire Bonder

US$4,500.00-10,000.00
1 Piece(MOQ)
Manual-Semi Ultrasonic Gold Ball Wedge Wire Bonding Machine Wire Bonder

Manual-Semi Ultrasonic Gold Ball Wedge Wire Bonding Machine Wire Bonder

US$51,000.00-80,000.00
1 Piece(MOQ)
Semiconductor Tube Integrated Circuit Package Manual Wire Ball Bonder Wedge Bonding Machine

Semiconductor Tube Integrated Circuit Package Manual Wire Ball Bonder Wedge Bonding Machine

US$4,500.00-10,000.00
1 Piece(MOQ)
MD-PT3018 Bond Pull Tester Wire Wedge Bonder

MD-PT3018 Bond Pull Tester Wire Wedge Bonder

US$3,000.00-6,000.00
1 Piece(MOQ)
Manual Ultrasonic Heavy Wire Wedge Bonder

Manual Ultrasonic Heavy Wire Wedge Bonder

US$500.00-8,000.00
1 Piece(MOQ)
Small-Batch Laboratory Research Automatic Wire Wedge Bonder Wedge Bonding Device

Small-Batch Laboratory Research Automatic Wire Wedge Bonder Wedge Bonding Device

US$7,000.00-30,000.00
1 Piece(MOQ)
Manual Semi Auto Wedge Gold Wire Ball Bonder Bonding Machine Wire Bonder

Manual Semi Auto Wedge Gold Wire Ball Bonder Bonding Machine Wire Bonder

US$51,000.00-80,000.00
1 Piece(MOQ)
Ball Wedge Welding Manual Semi Ball Wedge Wire Bonding Machine Wire Bonder

Ball Wedge Welding Manual Semi Ball Wedge Wire Bonding Machine Wire Bonder

US$51,000.00-80,000.00
1 Piece(MOQ)
Semiconductor Chips Lab Wire Bonding Machine / Manual Semi-Auto Ball Wedge Wire Bonder

Semiconductor Chips Lab Wire Bonding Machine / Manual Semi-Auto Ball Wedge Wire Bonder

US$51,000.00-80,000.00
1 Piece(MOQ)
Laboratory Packaging Equipment Wire Bonding Machine Manual-Semi Ball Wedge Wire Bonder

Laboratory Packaging Equipment Wire Bonding Machine Manual-Semi Ball Wedge Wire Bonder

US$51,000.00-80,000.00
1 Piece(MOQ)
18650 26800 Lithium Battery Automatic Heavy Aluminum Wire Wedge Bonder Bonding Machine

18650 26800 Lithium Battery Automatic Heavy Aluminum Wire Wedge Bonder Bonding Machine

US$45,000.00-65,000.00
1 Piece(MOQ)
Manual Semi-Automatic Deep Cavity Wedge or Gold Ball Wire Bonder Bonding Machine

Manual Semi-Automatic Deep Cavity Wedge or Gold Ball Wire Bonder Bonding Machine

US$51,000.00-80,000.00
1 Piece(MOQ)
Multi Chip System in Package SIP Deep Access Automatic Ball Wire Bonder

Multi Chip System in Package SIP Deep Access Automatic Ball Wire Bonder

US$120,000.00-150,000.00
1 Piece(MOQ)
Laboratory Uses Diode Laser Tube Inner Lead Wafer Manual Wire Bonder Bond

Laboratory Uses Diode Laser Tube Inner Lead Wafer Manual Wire Bonder Bond

US$4,500.00-10,000.00
1 Piece(MOQ)
Chip Packaging Gold Wire Ball Bonding Device Chip Gold Ball Wire Bonder

Chip Packaging Gold Wire Ball Bonding Device Chip Gold Ball Wire Bonder

US$4,500.00-10,000.00
1 Piece(MOQ)
High Speed Automatic Series automatic semiconductor wire ball bonder for IC LED package

High Speed Automatic Series automatic semiconductor wire ball bonder for IC LED package

US$72,000.00-150,000.00
1 Piece(MOQ)
Sample Available
Tec Optical Device Flip Chip Die Bonder Die Bonding Eutectic Die Attach

Tec Optical Device Flip Chip Die Bonder Die Bonding Eutectic Die Attach

US$50,000.00-100,000.00
1 Piece(MOQ)
Double Drive Linear Motor Gantry Structure Glue Dispensing and Die Bonding Machine / Dispenser and Die Bonder

Double Drive Linear Motor Gantry Structure Glue Dispensing and Die Bonding Machine / Dispenser and Die Bonder

US$125,000.00-150,000.00
1 Piece(MOQ)
Lithium Ion Battery Pack Wire Bonding Aluminum Heavy Wire Weld Bonder

Lithium Ion Battery Pack Wire Bonding Aluminum Heavy Wire Weld Bonder

US$4,000.00-8,000.00
1 Piece(MOQ)
Film to Film Flip Chip Bonder Eutectic Crystal Planting Die Attach Sorter

Film to Film Flip Chip Bonder Eutectic Crystal Planting Die Attach Sorter

US$25,000.00-99,999.00
1 Piece(MOQ)
Battery Pack IGBT Automatic Aluminum Heavy Wire Bonding Machine Wire Bonder

Battery Pack IGBT Automatic Aluminum Heavy Wire Bonding Machine Wire Bonder

US$35,000.00-65,000.00
1 Piece(MOQ)
Semiconductor Machine IC to Package Full Automatic Deep Access Big Area Ball Bonding Machine Wire Bonder

Semiconductor Machine IC to Package Full Automatic Deep Access Big Area Ball Bonding Machine Wire Bonder

US$72,000.00-150,000.00
1 Piece(MOQ)
Sample Available
Automatic Thick Aluminium Wire Bonding Machine Wire Bonder for to-220 to-3

Automatic Thick Aluminium Wire Bonding Machine Wire Bonder for to-220 to-3

US$45,000.00-65,000.00
1 Piece(MOQ)
Desktop Laboratory Gantry High-Precision Small Multifunctional Automatic Die Attach Die Mounter Automatic Eutectic Patch Chip Bonder

Desktop Laboratory Gantry High-Precision Small Multifunctional Automatic Die Attach Die Mounter Automatic Eutectic Patch Chip Bonder

US$116,000.00-150,000.00
1 Piece(MOQ)
Capillary Ultrasonic Experimental Lab Manul Wire Bonding Machine Wire Bonder

Capillary Ultrasonic Experimental Lab Manul Wire Bonding Machine Wire Bonder

US$4,000.00-8,000.00
1 Piece(MOQ)
Laboratory Micro-Component Photodiode Chip Attachment Submicron Multifunctional Die Bonder

Laboratory Micro-Component Photodiode Chip Attachment Submicron Multifunctional Die Bonder

US$99,999.00-999,999.00
1 Piece(MOQ)
Mddb550 Full-Automatic COB Smart Die Bonder

Mddb550 Full-Automatic COB Smart Die Bonder

US$25,000.00-30,000.00
1 Piece(MOQ)
Reel Feeder Type Die Bonder

Reel Feeder Type Die Bonder

US$25,000.00-30,000.00
1 Piece(MOQ)
Guangdong Xinling Industrial Co., Ltdmic-icon
Satisfies 1/1 of your requirement
China Used Besi Datacon 8800 FC Quantum Advx Manufactures Automatic Ball Wire Flip Chip Wedge Die Bonder

China Used Besi Datacon 8800 FC Quantum Advx Manufactures Automatic Ball Wire Flip Chip Wedge Die Bonder

US$158,000.00-259,500.00
1 Piece(MOQ)
Stable China Semiconductor Equipment Wire Bonding Machine OE 360 Aluminum Wire Bonder

Stable China Semiconductor Equipment Wire Bonding Machine OE 360 Aluminum Wire Bonder

US$450,000.00-560,000.00
1 Set(MOQ)
China Factory Price Semiconductor Wire Bonding Machine Used K&S Wire Bonder

China Factory Price Semiconductor Wire Bonding Machine Used K&S Wire Bonder

US$450,000.00-590,000.00
1 Set(MOQ)
Intelligent China Used Semiconductor Wire Bonding Machine OE 360 Aluminum Wire Bonder

Intelligent China Used Semiconductor Wire Bonding Machine OE 360 Aluminum Wire Bonder

US$450,000.00-580,000.00
1 Set(MOQ)
Asm Die Flip Chip Semiconductor Equipment Supplier K&S Maxum-Plus Machine Manufacturers Gold Automatic Wedge Wire Bonder

Asm Die Flip Chip Semiconductor Equipment Supplier K&S Maxum-Plus Machine Manufacturers Gold Automatic Wedge Wire Bonder

US$35,000.00-60,000.00
1 Set(MOQ)
China Reliable Semiconductor Wire Bonding Machine Manufactures OE Aluminum Wire Bonder

China Reliable Semiconductor Wire Bonding Machine Manufactures OE Aluminum Wire Bonder

US$430,000.00-565,000.00
1 Set(MOQ)
Automatic China Used Semiconductor Wire Bonding Machine OE 360 Aluminum Wire Bonder

Automatic China Used Semiconductor Wire Bonding Machine OE 360 Aluminum Wire Bonder

US$450,000.00-590,000.00
1 Set(MOQ)
China Multifunctional Semiconductor Wire Bonding Machine OE M360c Aluminum Wire Bonder

China Multifunctional Semiconductor Wire Bonding Machine OE M360c Aluminum Wire Bonder

US$430,000.00-555,000.00
1 Set(MOQ)
Intelligent China Used Semiconductor Wire Bonding Machine K&S Powernexx™ Wire Bonder

Intelligent China Used Semiconductor Wire Bonding Machine K&S Powernexx™ Wire Bonder

US$405,000.00-595,000.00
1 Set(MOQ)
China Advanced Semiconductor Wire Bonding Machine Manufactures OE M360c Aluminum Wire Bonder

China Advanced Semiconductor Wire Bonding Machine Manufactures OE M360c Aluminum Wire Bonder

US$430,000.00-555,000.00
1 Set(MOQ)
Asm Ihawkv Automatic Wire Bonding Machine Supplier Eagle-Aero-Gocu Gold Wire Ball Bonder

Asm Ihawkv Automatic Wire Bonding Machine Supplier Eagle-Aero-Gocu Gold Wire Ball Bonder

US$100,000.00-1,000,000.00
1 Set(MOQ)
China Used Semiconductor Wire Bonding Machine High-Reliability K&S Rapid™ PRO Wire Bonder

China Used Semiconductor Wire Bonding Machine High-Reliability K&S Rapid™ PRO Wire Bonder

US$435,000.00-600,000.00
1 Set(MOQ)
Excellent China Used Semiconductor Wire Bonding Machine K&S Powercomm™ Wire Bonder

Excellent China Used Semiconductor Wire Bonding Machine K&S Powercomm™ Wire Bonder

US$425,000.00-595,000.00
1 Set(MOQ)
Compatible China Semiconductor Wire Bonding Machine Supplier OE 360 Aluminum Wire Bonder

Compatible China Semiconductor Wire Bonding Machine Supplier OE 360 Aluminum Wire Bonder

US$430,000.00-560,000.00
1 Set(MOQ)
Intelligent Asm Islinda Die Bonding Machine Manufacture Cheap China Used Die Bonder

Intelligent Asm Islinda Die Bonding Machine Manufacture Cheap China Used Die Bonder

US$420,000.00-700,000.00
1 Set(MOQ)
Semiconductor Wire Bonding Machine High-Precision Used K&S Asterion EV Wire Bonder

Semiconductor Wire Bonding Machine High-Precision Used K&S Asterion EV Wire Bonder

US$460,000.00-600,000.00
1 Set(MOQ)
High-Speed Reliable Semiconductor Wire Bonding Machine Suppliers Used K&S Wire Bonder

High-Speed Reliable Semiconductor Wire Bonding Machine Suppliers Used K&S Wire Bonder

US$480,000.00-600,000.00
1 Set(MOQ)
Automatic Cheap K&S Iconn Plus Wire Bonding Machine Smart Semiconductor Wire Bonder

Automatic Cheap K&S Iconn Plus Wire Bonding Machine Smart Semiconductor Wire Bonder

US$23,000.00-44,000.00
1 Set(MOQ)
China Used Semiconductor Wire Bonding Machine Precise K&S Rapid™ PRO Wire Bonder

China Used Semiconductor Wire Bonding Machine Precise K&S Rapid™ PRO Wire Bonder

US$435,000.00-585,000.00
1 Set(MOQ)
Innovative China Semiconductor Wire Bonding Machine K&S Atpremier Mem Plus™ Wire Bonder

Innovative China Semiconductor Wire Bonding Machine K&S Atpremier Mem Plus™ Wire Bonder

US$400,000.00-590,000.00
1 Set(MOQ)
Multi-Functional Semiconductor Wire Bonding Machine Used K&S Iconn Plus Wire Bonder

Multi-Functional Semiconductor Wire Bonding Machine Used K&S Iconn Plus Wire Bonder

US$450,000.00-600,000.00
1 Set(MOQ)

Sourcing guidance for Wedge Bonder

What are the key technical specifications to consider when selecting a Wedge Bonder for semiconductor packaging?

When sourcing a Wedge Bonder, you must prioritize ultrasonic power stability and transducer frequency (typically 60kHz to 100kHz) to ensure consistent bond quality. For high-precision tasks, look for machines with a positioning accuracy of ±2μm to ±5μm. Additionally, verify the wire diameter compatibility, as most industrial wedge bonders should handle aluminum or gold wire ranging from 17μm to 75μm for standard applications, or up to 500μm for heavy-wire power electronics.

How do I evaluate the automation level and throughput of a Wedge Bonder?

B2B buyers should distinguish between Manual, Semi-Automatic, and Fully Automatic systems based on production volume. For R&D or small batches, a manual bonder is cost-effective; however, for mass production, ensure the unit features Deep Access capability and a high-speed bonding head capable of at least 2-4 wires per second. Check if the software supports Pattern Recognition Systems (PRS) to reduce human error and increase UPH (Units Per Hour).

What compliance standards and certifications are mandatory for international trade of electronic assembly equipment?

Ensure the supplier provides CE Marking for the European market and UL certification for North America to guarantee electrical safety. Since these machines are used in sensitive environments, verify compliance with ESD (Electrostatic Discharge) safety standards and ISO 9001:2015 quality management systems. For cleanroom applications, confirm the equipment meets Class 100 or Class 1000 cleanroom compatibility.

What are the maintenance requirements for ensuring the longevity of a Wedge Bonder?

The wedge tool (capillary) is a consumable that requires replacement every 5,000 to 50,000 bonds depending on the material. Buyers should ensure the supplier offers a steady supply of tungsten carbide or titanium carbide wedges. Regular calibration of the ultrasonic generator and cleaning of the wire clamp mechanism are essential to prevent bond lifting or wire breakage.

Cross-Border Procurement & Risk Management for Wedge Bonders

How can I mitigate the risk of receiving damaged precision machinery during international shipping?

Wedge bonders contain highly sensitive optical and electronic components. You must mandate vacuum-sealed anti-static packaging and wooden crate packing with shock-absorption bases. Request the use of ShockWatch and TiltWatch indicators on the exterior of the crate to monitor handling during transit. It is highly recommended to use CIF (Cost, Insurance, and Freight) terms and purchase comprehensive marine insurance.

What strategies should be used when negotiating with Wedge Bonder suppliers on Made-in-China.com?

Focus negotiations on the Total Cost of Ownership (TCO) rather than just the sticker price. Request a spare parts package (including extra transducers and wedges) to be included in the initial quote. For high-value machinery, negotiate a staged payment plan, such as 30% deposit, 60% after FAT (Factory Acceptance Test) via video link, and 10% after successful installation and commissioning at your facility.

What are the critical transaction security tips for high-value industrial equipment?

Always conduct transactions through secure payment channels provided by professional platforms like Made-in-China.com to ensure payment protection. Before final payment, hire a third-party inspection agency (like SGS or Intertek) to perform a pre-shipment inspection to verify that the machine's bonding pull-test results meet your specific technical requirements.

How do international trade policies and dual-use regulations affect the export of Wedge Bonders?

Some high-precision wedge bonders may be classified under dual-use technology regulations (civilian and military). Buyers must confirm with the supplier whether an Export License is required from the country of origin. Ensure all HS Codes (typically under 8486.20) are correctly declared to avoid customs delays or seizures related to international trade sanctions or technology transfer restrictions.

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